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在存储方面，合作涉及为博通未来人工智能加速器提供相关解决方案；在代工方面，重点包括三星2纳米及更先进工艺，并覆盖部分通信产品。双方还计划探索基于先进工艺的2.3D和2.5D集成，以提高计算与网络芯片的性能和能源利用效率。合作表明，人工智能硬件竞争正在延伸到完整系统的匹配能力，单颗芯片的规格不能独立决定最终表现。谅解备忘录反映双方合作意向和技术范围，具体供货、产能及产品落地仍需后续执行。这类跨环节协作有助于提前协调设计与制造需求，但最终效果仍要由实际产品及平台验证来体现。
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